We’ve definitely seen an uptick in investments for physical hardware companies that are working to innovate on computing — and address the lack of power for the needs of AI. The latest? Vancouver, Washington startup PowerLattice which has raised $25 million.
PowerLattice provides a true monolithic solution with a vertical design that unifies our miniaturized proprietary on-die magnetic inductors, advanced control circuit innovations, and a programmable software layer in one compact silicon die.
This chiplet architecture is inherently scalable and highly configurable, enabling seamless adaptation to any SoC power topology. Multiple chiplets can be deployed in parallel to construct the complete power delivery solution for a given SoC. Customers can implement power domains of varying shapes and sizes, optimized to the spatial and electrical requirements of the target system.
The chiplet’s z-height can be tightly controlled during fabrication, achieving targeted thickness in the low-hundreds-of-micrometer range. This flexibility supports multiple package integration schemes, from mounting at substrate land side to fully embedding in substrates or interposers.
“Power is the defining challenge for AI’s future,” said Peng Zou, Co-Founder, CEO and President of PowerLattice. “Data centers are already starting to hit a power wall and the problem is only going to get worse if we don’t rethink how chips are powered. By bringing power directly into the processor package, we’re delivering the performance and efficiency AI needs to keep scaling beyond today’s limits.”
According to TechCrunch, former Intel CEO and an investor through Playground Global is bullish on the tech, stating: “The idea is bold, the benefits are large, and I expect others will be saying, ‘That’s a great idea. Let me try as well.'”
For more information, see the coverage from GeekWire, The Oregonian, and the Portland Business Journal.
